EE5110/EE6110 Selected Topics on Automation and Control

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EE5110/EE6110 Selected Topics on Automation and Control

Segment A: Semiconductor Manufacturing

Description:

Temperature control is critical in the processing of semiconductor wafers in various thermal processing steps such as RTP and Bake/Chill.  In this assignment, our objective is to design a temperature controller for the baking operation in lithography.  Your target is to minimize    the temperature uniformity across the wafer during the entire bake operation.  The wafer is assumed to be of 450mm in diameter.  The design specification for our heating process         should have the following characteristics:

1.    A bake operation of about 3 minutes.

2.    The wafer steady-state temperature should be 1200C.

3.    The overshoot on the wafer temperature should not be more than 50C

4.    The temperature non-uniformity during the bake process should be minimized.

Detailed description of the programmable multi-zone thermal processing system can be       found in [1].  The simplified state-space model is given in the Matlab file, ibc_modelt22.m.   The output of the Matlab file gives the time and temperature of the bake-plate and wafer,   you can use it together with an ode solver or extract out the state-space matrices.  For this  project, you can discretize your bake-plate to N=3 zones, i.e. you should simulate for 3          zones.  In addition, note that feedback to your controller is the bake-plate temperature, not the wafer temperature since there are no sensors on the wafer although the model will give you both the wafer and bake-plate temperatures.

For your plots, you should show the following:

1.    Bake-plate and wafer temperatures across the N zones during the entire bake operation.

2.    Steady-state temperature distribution across the wafer at the N zones.

3.    Temperature non-uniformity across the wafer during the bake operation.

4.    Input signal into the bake-plate at the N zones during the bake operation.

All simulation results, discussions, and observations should be documented in a full technical report with MATLAB source codes during submission.

Please put your report and Matlab code together in a zip file.  Name the file A1234567.zip (where A1234567 is your matric number) and upload to our Segment A submission folder.

Due Date: 16 September 2022, 12 noon

References:

[1] Tay, A., WK Ho, N Hu, XQ Chen, “Estimation of wafer warpage profile during thermal processing in microlithography”, Review of Scientific Instruments, 76, 075111 (2005)

[2] Tay, A., HT Chua, YH Wang, G Yang, WK Ho, “Modeling and Real-Time Control of              Multizone Thermal Processing System for Photoresist Processing”, Industrial & Engineering Chemistry Research, 52, 4805−4814 (2013)